Hydrogen Peroxide G1 Grade (30%)
H₂O₂ · CAS 7722-84-1
G1 grade hydrogen peroxide (30% w/w) for PCB copper micro-etching, general surface oxidation treatment, wastewater treatment, textile bleaching, and disinfection applications. Lower purity than semiconductor grades but with controlled metal content for sensitive industrial processes.
Molecular Weight
34.01 g/mol
Boiling Point
150.2 °C
Density
1.11 g/mL
Molecular Formula
Available Grades
Analytical Specification
Analytical Specification Table
All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.
| Parameter | Test Method | Unit | G1 |
|---|---|---|---|
| Assay (H₂O₂) | Titration | % | 29.0–32.0 |
| Total Metals | ICP-OES | ppb ea. | ≤500 |
| Fe (Iron) | ICP-OES | ppb | ≤200 |
| Total Organic C | TOC | ppm | ≤10 |
| Free Acidity | Titration | ppm | ≤300 |
★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.
Grade Comparison
G1 → G5 Purity Scale
Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.
All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot. Request CoA template →
Application Areas
Where Hydrogen Peroxide G1 Grade Is Used
Semiconductor Process
- PCB copper micro-etch (ammoniacal H₂O₂)
- General circuit board oxidation treatment
Laboratory & Analytical
- General oxidation reactions
- disinfection solution preparation
Industrial & Other
- PCB manufacturing (Cu etch)
- textile bleaching
- paper pulp bleaching
- wastewater treatment
- food equipment disinfection (E929)
Battery & Energy Storage
Packaging & Supply
Available Container Formats
Related Products
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