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Applications

Process Chemistry for
7 Industry Segments

From sub-3nm logic wafer cleaning to EV battery electrolyte and HPLC pharmaceutical analysis — PureTech provides the right grade for every application.

Market Applications

Application by Industry Segment

Each market segment lists the key chemistry and links to full product specification sheets.

01

Logic & High-Performance Computing

FinFET / GAA / EUV · <3nm Nodes

Sub-3nm logic and gate-all-around (GAA) devices require total metal contamination below 0.1 ppb per element. Our SEMI G5 IPA, ethanol, acetone, and PGMEA are EUV-compatible and validated for post-FEOL etch rinse, BEOL copper barrier rinse, Marangoni drying, photomask cleaning, and FOUP maintenance.

FinFETGAAEUV<3nmSub-5nm

Key Chemistry

EIPA G5Ethanol G4Acetone G4PGMEA G4n-Heptane G4
02

DRAM & 3D NAND Flash Memory

High-Volume · IBC / Bulk Supply

Memory fabs consume IPA and cleaning solvents in high volumes across dozens of wet cleaning steps per wafer pass. PureTech delivers lot-to-lot consistency with CoA on every shipment. IPA and acetone support multi-step CMP post-clean and final rinse sequences in DRAM capacitor and 3D NAND channel hole fabrication.

DRAM3D NANDHigh VolumeBulk IBC

Key Chemistry

EIPA G4/G5Acetone G3Ethanol G3NMP G3
03

Advanced & Heterogeneous Packaging

FOWLP / HBM / 2.5D / 3D-IC / CoW

Fan-out wafer-level packaging, chip-on-wafer, 2.5D interposer, and 3D-IC stacking require precision solvent cleaning. PGMEA and PGME support RDL patterning lithography; NMP dissolves thick polyimide precursors for HDI substrates; IPA provides contamination-free substrate cleaning at every stage.

FOWLPHBM2.5D3D-ICCoW/WoW

Key Chemistry

PGMEA G4PGME G4NMP G4EIPA G4Acetone G3
04

EV Lithium-Ion Battery

NMC / LFP / NCA · Electrolyte & Electrode Slurry

Electronic grade DMC is a critical co-solvent in LiPF₆-based electrolytes (EC/DMC/EMC system). G5 grade DMC with <0.1 ppb metals and ≤10 ppm water ensures minimal LiPF₆ hydrolysis and optimal ionic conductivity. NMP dissolves PVDF binder for NMC and LFP cathode slurry coating in EV gigafactory production lines.

Li-ionNMCLFPElectrolytePVDF Slurry

Key Chemistry

DMC G4/G5NMP G4Ethanol G3DMSO G3
05

Display & OLED

TFT-LCD / AMOLED / MicroLED / Flexible

PGMEA and PGME are the primary solvents for positive photoresist in TFT-LCD array patterning. DMSO and NMP serve as organic light-emitting layer coating solvents in OLED inkjet printing. IPA provides final substrate cleaning. Electronic grade purity ensures zero residue contamination of pixel electrodes.

TFT-LCDAMOLEDMicroLEDFlexible Display

Key Chemistry

PGMEA G3PGME G3NMP G3DMSO G3EIPA G3
06

Compound Semiconductor & Photonics

GaN / SiC / InP / GaAs / Si Photonics / VCSEL

GaN power devices, SiC MOSFETs, InP HEMTs, and GaAs solar cells require halide-free IPA with <1 ppb Cl⁻ and F⁻ to prevent surface pitting and ohmic contact degradation. n-Heptane G4 is used for GaN-on-SiC MOCVD reactor cleaning; ethanol for LED and VCSEL device cleaning.

GaNSiCInPGaAsSi PhotonicsVCSEL

Key Chemistry

EIPA G4Ethanol G3n-Heptane G4Acetone G3
07

HPLC / Pharmaceutical & Bioanalytical

Drug Analysis / QC / LC-MS / Bioanalytical

LC-MS grade acetonitrile is the gold standard reverse-phase mobile phase for pharmaceutical API analysis. HPLC-gradient methanol and ethanol meet strict UV absorbance requirements. Anhydrous THF and DCM support Grignard reactions, GPC polymer analysis, and Fmoc/Boc peptide synthesis. n-Hexane for food fat extraction per ISO 6492.

HPLCLC-MSPharma QCBioanalytical

Key Chemistry

Acetonitrile LC-MSMethanol HPLC-GTHF HPLCDCM Pharman-Hexane HPLC

Process Reference

Chemical-to-Process Mapping

Which PureTech product to specify for each process step — from fab to battery factory.

Process StepChemistryRolePureTech Product
RCA SC-1 (APM)IPA rinse after APMOrganic & particle removalEIPA G4/G5
RCA SC-2 (HPM)IPA rinse after HPMMetal ion removal rinseEIPA G4/G5
Piranha (SPM)Acetone rinse assistPhotoresist & organic stripAcetone G4
Resist EBR CoatPGME / PGMEAEdge bead removal & EBR coatPGME G4/G5
ArF/EUV LithoPGMEA primary solventPhotoresist formulationPGMEA G4/G5
NTD DevelopmentButyl acetate solventNegative-tone develop (EUV)BuOAc G4
Thick PR StripNMP / AcetonePost-etch resist removalNMP G4
PI/BCB CoatingNMP solventPolyimide precursor coatingNMP G4/G5
CMP Post-CleanIPA SRDBrush-scrub spin-rinse-dryEIPA G4/G5
Marangoni DryIPA G5 vaporStiction-free final dryEIPA G5
Li-Battery SlurryNMPPVDF binder dissolutionNMP G4/G5
Electrolyte MixDMC co-solventLiPF₆ in EC/DMC/EMCDMC G4/G5
HPLC AnalysisMeCN / MeOHReverse-phase mobile phaseACN LC-MS

Application Support

Process-Specific
Technical Guidance

Our FAE team provides compatibility data, qualification protocols, and on-site process engineering support.