Hydrochloric Acid (Electronic Grade)
HCl · CAS 7647-01-0
Ultra-high purity hydrochloric acid for RCA SC-2 (HPM: HCl/H₂O₂/H₂O) metal ion removal, gold and aluminum selective etching, and post-CMP cleaning. G5 grade with total metals <0.1 ppb per element.
Molecular Weight
36.46 g/mol
Boiling Point
110 °C (azeotrope)
Density
1.18 g/mL (37%)
Molecular Formula
Available Grades
Analytical Specification
Analytical Specification Table
All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.
| Parameter | Test Method | Unit | G4 | G5 ★ |
|---|---|---|---|---|
| Assay | Titration | % | 36.0–38.0 | 36.0–38.0 |
| Total Metals | ICP-MS | ppb ea. | ≤0.5 | <0.1 |
| Fe (Iron) | ICP-MS | ppb | ≤0.2 | <0.05 |
| Free Chlorine | Titration | ppm | ≤0.5 | ≤0.1 |
| Sulfate (SO₄²⁻) | IC | ppb | ≤50 | ≤10 |
★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.
Grade Comparison
G1 → G5 Purity Scale
Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.
All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot. Request CoA template →
Application Areas
Where Hydrochloric Acid Is Used
Semiconductor Process
- RCA SC-2 (HPM) metal ion removal
- Gold (Au) selective etching
- Al/Ti metal removal
- Post-ion-implant metal clean
- Compound semiconductor (GaAs, InP) surface preparation
Laboratory & Analytical
- pH adjustment
- ion chromatography eluent
- gravimetric analysis
Industrial & Other
- PCB copper etching
- steel pickling
- food processing (E507)
Packaging & Supply
Available Container Formats
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