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Hydrochloric Acid (Electronic Grade)

HCl · CAS 7647-01-0

Ultra-high purity hydrochloric acid for RCA SC-2 (HPM: HCl/H₂O₂/H₂O) metal ion removal, gold and aluminum selective etching, and post-CMP cleaning. G5 grade with total metals <0.1 ppb per element.

RCA SC-2 (HPM) metal ion removalGold (Au) selective etchingAl/Ti metal removalPost-ion-implant metal cleanCompound semiconductor (GaAs, InP) surface preparation

Molecular Weight

36.46 g/mol

Boiling Point

110 °C (azeotrope)

Density

1.18 g/mL (37%)

Molecular Formula

HCl
SEMI C12
CAS Number7647-01-0
Boiling Point110 °C (azeotrope)
Density1.18 g/mL (37%)
MW36.46 g/mol

Available Grades

G2G3G4G5

Analytical Specification

Analytical Specification Table

All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.

ParameterTest MethodUnitG4G5 ★
AssayTitration%36.0–38.036.0–38.0
Total MetalsICP-MSppb ea.≤0.5<0.1
Fe (Iron)ICP-MSppb≤0.2<0.05
Free ChlorineTitrationppm≤0.5≤0.1
Sulfate (SO₄²⁻)ICppb≤50≤10

★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.

Grade Comparison

G1 → G5 Purity Scale

Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.

Electronic Grade Purity Comparison — SEMI C1 StandardG1 → G5
GradePurity (GC)Metals (ICP)ParticlesWater (KF)Process Node
G1
≥99.0%
≤50 ppb≤500/mL≤500 ppmPCB / Display / Solar
G2
≥99.9%
≤10 ppb≤100/mL≤50 ppm≥180nm Mature Node
G3
≥99.99%
≤2 ppb≤20/mL≤20 ppm45–180nm
G4
≥99.999%
≤0.5 ppb≤10/mL≤10 ppm7–45nm
G5
≥99.9999%
<0.1 ppb≤5/mL≤5 ppm<7nm / EUV / Marangoni

All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot.  Request CoA template →

Application Areas

Where Hydrochloric Acid Is Used

Semiconductor Process

  • RCA SC-2 (HPM) metal ion removal
  • Gold (Au) selective etching
  • Al/Ti metal removal
  • Post-ion-implant metal clean
  • Compound semiconductor (GaAs, InP) surface preparation

Laboratory & Analytical

  • pH adjustment
  • ion chromatography eluent
  • gravimetric analysis

Industrial & Other

  • PCB copper etching
  • steel pickling
  • food processing (E507)

Packaging & Supply

Available Container Formats

1 L
5 L
20 L
200 L

Get Started

Request a Sample or
Technical Quote

Our application engineers respond with full CoA data, ICP-MS reports, and supply chain details within one business day.