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Nitric Acid (Electronic Grade)

HNO₃ · CAS 7697-37-2

Electronic grade nitric acid for metal surface passivation, aqua regia preparation (HNO₃/HCl 1:3), and stainless steel/titanium surface treatment. Also used in selective tungsten (W) and molybdenum (Mo) etching in advanced CMOS gate and contact formation.

Aqua regia (HNO₃/HCl) noble metal etchingTungsten (W) selective etch (with H₂O₂)Metal surface passivationTitanium/TiN surface preparationTool and wet bench cleaning

Molecular Weight

63.01 g/mol

Boiling Point

83 °C (68%)

Density

1.40 g/mL (68%)

Molecular Formula

HNO₃
CAS Number7697-37-2
Boiling Point83 °C (68%)
Density1.40 g/mL (68%)
MW63.01 g/mol

Available Grades

G2G3G4

Analytical Specification

Analytical Specification Table

All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.

ParameterTest MethodUnitG4
AssayTitration%68.0–70.0
Total MetalsICP-MSppb ea.≤0.5
Fe (Iron)ICP-MSppb≤0.2
Cl⁻ (Chloride)ICppb≤50

★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.

Grade Comparison

G1 → G5 Purity Scale

Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.

Electronic Grade Purity Comparison — SEMI C1 StandardG1 → G5
GradePurity (GC)Metals (ICP)ParticlesWater (KF)Process Node
G1
≥99.0%
≤50 ppb≤500/mL≤500 ppmPCB / Display / Solar
G2
≥99.9%
≤10 ppb≤100/mL≤50 ppm≥180nm Mature Node
G3
≥99.99%
≤2 ppb≤20/mL≤20 ppm45–180nm
G4
≥99.999%
≤0.5 ppb≤10/mL≤10 ppm7–45nm
G5
≥99.9999%
<0.1 ppb≤5/mL≤5 ppm<7nm / EUV / Marangoni

All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot.  Request CoA template →

Application Areas

Where Nitric Acid Is Used

Semiconductor Process

  • Aqua regia (HNO₃/HCl) noble metal etching
  • Tungsten (W) selective etch (with H₂O₂)
  • Metal surface passivation
  • Titanium/TiN surface preparation
  • Tool and wet bench cleaning

Laboratory & Analytical

  • Trace metal digestion (ICP-MS sample prep)
  • standard solution preparation
  • qualitative analysis

Industrial & Other

  • PCB through-hole cleaning
  • stainless steel passivation
  • fertilizer production

Packaging & Supply

Available Container Formats

1 L
5 L
20 L
200 L

Get Started

Request a Sample or
Technical Quote

Our application engineers respond with full CoA data, ICP-MS reports, and supply chain details within one business day.