Propylene Glycol Monomethyl Ether Acetate (PGMEA)
CH₃COOCH(CH₃)CH₂OCH₃ · CAS 108-65-6
The dominant photoresist primary solvent across all advanced semiconductor lithography nodes. PGMEA is the primary solvent in ArF immersion, EUV, and KrF CAR photoresists, OLED organic EL layer inkjet inks, polyimide film precursors, and spin-on carbon (SOC) hard-mask formulations.
Molecular Weight
132.16 g/mol
Boiling Point
146 °C
Density
0.965 g/mL
Molecular Formula
Available Grades
Analytical Specification
Analytical Specification Table
All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.
| Parameter | Test Method | Unit | G4 | G5 ★ | AR |
|---|---|---|---|---|---|
| Assay (GC) | GC-FID | % | ≥99.99 | ≥99.999 | ≥99.5 |
| Water Content (KF) | Karl Fischer | ppm | ≤30 | ≤10 | ≤2000 |
| Total Metals (ICP-MS) | ICP-MS | ppb ea. | ≤0.5 | <0.1 | — |
| Acetic Acid | GC-FID | ppm | ≤20 | ≤5 | ≤50 |
| 1-Methoxy-2-Propanol (PGME) | GC-FID | ppm | ≤50 | ≤20 | ≤100 |
| Propylene Glycol Diacetate | GC-FID | ppm | ≤30 | ≤10 | — |
| Acidity (as HAc) | Titration | ppm | ≤10 | ≤5 | ≤20 |
| Residue on Evaporation | Gravimetric | ppm | ≤2 | ≤0.5 | ≤10 |
| Color (APHA) | ASTM D1209 | Hazen | ≤5 | ≤5 | ≤10 |
| Peroxide (as H₂O₂) | Iodometric | ppm | ≤1 | ≤0.5 | ≤5 |
★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.
Grade Comparison
G1 → G5 Purity Scale
Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.
All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot. Request CoA template →
Application Areas
Where Propylene Glycol Monomethyl Ether Acetate Is Used
Semiconductor Process
- ArF immersion photoresist primary solvent (193i)
- EUV chemically-amplified resist (CAR) formulation
- EUV metal oxide resist (MOR) formulation solvent
- KrF / I-line positive photoresist primary solvent
- Spin-on carbon (SOC) hard-mask dielectric solvent
- Spin-on glass (SOG) intermetal dielectric solvent
- Negative-tone developer (NTD) solvent in double patterning
- OLED organic EL layer inkjet printing solvent
- Polyimide (PI) precursor coating for HDI packaging
Laboratory & Analytical
- Polymer thin-film coating research
- photocatalyst thin-film deposition
- organic synthesis solvent
Industrial & Other
- Flat panel display (AMOLED/TFT-LCD) lithography
- printed electronics R2R coating
- gravure printing inks
Packaging & Supply
Available Container Formats
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