Semiconductor & IC Fabrication
Wet Chemicals for Every Node
Semiconductor device fabrication demands the highest purity wet chemicals at every process step. PureTech Materials supplies the complete range of SEMI C1 certified electronic grade solvents, process acids, oxidants, and bases for logic foundry, memory, OSAT, and compound semiconductor applications.
Key Challenges
What Makes Semiconductor & IC Fabrication Chemistry Demanding
Metal Contamination
Even sub-ppb metallic impurities at gate oxide interfaces cause threshold voltage shift and yield loss. G4/G5 grade with ICP-MS verification is mandatory for all front-end process steps.
Particle Control
Post-CMP and post-etch rinse steps require particle counts below 10 ct/mL at ≥0.5 μm. In-line LPC certification during ISO Class 3 fill ensures contamination-free delivery.
Supply Consistency
Lot-to-lot variation in trace metal levels causes process excursions. PureTech SPC-controlled manufacturing delivers ≤10% variation on all critical parameters.
EUV Compatibility
EUV resist solvents require total metals below 0.1 ppb and acidity below 5 ppm to prevent scanner optic contamination. G5 PGMEA and G5 IPA are validated for EUV tool maintenance.
Product Portfolio
Chemicals for Semiconductor & IC Fabrication
Process Mapping
Step-by-Step Chemical Guide
Piranha (SPM)
H₂SO₄ + H₂O₂Hot sulfuric-peroxide mixture strips organic and photoresist residues before diffusion and post-implant.
RCA SC-1 (APM)
NH₄OH + H₂O₂ + H₂OAmmonium-peroxide mixture removes particles and organic contamination. 1:1:5 ratio at 65–75°C.
RCA SC-2 (HPM)
HCl + H₂O₂ + H₂OHydrochloric-peroxide removes metal ion contamination. 1:1:6 ratio at 65–75°C.
Litho EBR / Coat
PGMEA / PGMEEdge bead removal and primary solvent for ArF immersion and EUV photoresist.
Resist Strip
NMP / AcetoneThick positive photoresist stripping. NMP G4 at 80°C for thick films.
CMP Post-Clean
IPA (SRD)Brush scrub and spin-rinse-dry after Cu/W/SiO₂ CMP.
Marangoni Dry
IPA G5 VaporWatermark-free final drying. Essential for sub-5nm and MEMS.
FAQ
Frequently Asked Questions
What SEMI grade IPA do I need for 7nm node CMP post-clean?
G4 (≥99.999%) or G5 (≥99.9999%) IPA is required for 7nm and below. G4 provides total metals ≤0.5 ppb and particles ≤10 ct/mL. G5 is specified for Marangoni drying and EUV tool maintenance where metals must be below 0.1 ppb per element.
What is the difference between SEMI C1 G4 and G5?
G4 (SEMI C1 Tier C): assay ≥99.999%, metals ≤0.5 ppb, particles ≤10/mL, water ≤10 ppm. G5 (SEMI C1 Tier D, 6N): assay ≥99.9999%, metals <0.1 ppb, particles ≤5/mL, water ≤5 ppm. G5 is specified for sub-7nm nodes, EUV, and Marangoni drying.
How do you verify metal content in electronic grade IPA?
ICP-MS quantifies 28 individual elements per production lot including Na, K, Fe, Cu, Cr, Ni, Al, and Zn. Detection limits are below 0.01 ppb for critical elements. Every lot ships with a CoA containing actual measured ICP-MS data — not pass/fail statements.
What packaging sizes are available for electronic grade IPA?
PureTech supplies IPA in 4L, 18L, 200L drums, 1000L IBCs, and bulk tanker. N₂ blanket is maintained throughout transport for G4/G5 grades. Dedicated tanker with full N₂ blanketing available for fabs consuming >50 MT/month.
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Semiconductor & IC Fabrication Supply
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