Home
Electronic G1Electronic Grade Solvents

NMP Electronic G1 Grade

C₅H₉NO · CAS 872-50-4

G1 NMP for mature-node thick photoresist stripping (≥180nm), general polyimide precursor coating, and Li-ion battery anode slurry applications where lower purity is acceptable. Significantly lower cost than G4/G5 for applications without stringent metal contamination budgets.

Thick positive photoresist stripping (≥180nm nodes)Polyimide (PI) precursor general coatingLCD alignment layer (PI) coatingGeneral PCB polyimide laminate processing

Molecular Weight

99.13 g/mol

Boiling Point

202 °C

Density

1.028 g/mL

Molecular Formula

C₅H₉NO
CAS Number872-50-4
Boiling Point202 °C
Density1.028 g/mL
MW99.13 g/mol

Available Grades

G1

Analytical Specification

Analytical Specification Table

All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.

ParameterTest MethodUnitG1
Assay (GC)GC-FID%≥99.0
Water Content (KF)Karl Fischerppm≤1000
Total MetalsICP-OESppb ea.≤100
Fe (Iron)ICP-OESppb≤50
Color (APHA)ASTM D1209Hazen≤20
Residue on Evap.Gravimetricppm≤15

★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.

Grade Comparison

G1 → G5 Purity Scale

Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.

Electronic Grade Purity Comparison — SEMI C1 StandardG1 → G5
GradePurity (GC)Metals (ICP)ParticlesWater (KF)Process Node
G1
≥99.0%
≤50 ppb≤500/mL≤500 ppmPCB / Display / Solar
G2
≥99.9%
≤10 ppb≤100/mL≤50 ppm≥180nm Mature Node
G3
≥99.99%
≤2 ppb≤20/mL≤20 ppm45–180nm
G4
≥99.999%
≤0.5 ppb≤10/mL≤10 ppm7–45nm
G5
≥99.9999%
<0.1 ppb≤5/mL≤5 ppm<7nm / EUV / Marangoni

All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot.  Request CoA template →

Application Areas

Where NMP Electronic G1 Grade Is Used

Semiconductor Process

  • Thick positive photoresist stripping (≥180nm nodes)
  • Polyimide (PI) precursor general coating
  • LCD alignment layer (PI) coating
  • General PCB polyimide laminate processing

Laboratory & Analytical

  • Polymer research solvent
  • PVDF dissolution (non-critical)

Industrial & Other

  • Wire enamel insulation processing
  • hollow fiber membrane manufacturing
  • textile dyeing auxiliary

Battery & Energy Storage

Graphite anode slurry (SBR/CMC binder system)
LFP cathode slurry (less critical)
Standard-grade cell electrolyte additive

Packaging & Supply

Available Container Formats

1 L
5 L
20 L
200 L
IBC

Get Started

Request a Sample or
Technical Quote

Our application engineers respond with full CoA data, ICP-MS reports, and supply chain details within one business day.