NMP Electronic G1 Grade
C₅H₉NO · CAS 872-50-4
G1 NMP for mature-node thick photoresist stripping (≥180nm), general polyimide precursor coating, and Li-ion battery anode slurry applications where lower purity is acceptable. Significantly lower cost than G4/G5 for applications without stringent metal contamination budgets.
Molecular Weight
99.13 g/mol
Boiling Point
202 °C
Density
1.028 g/mL
Molecular Formula
Available Grades
Analytical Specification
Analytical Specification Table
All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.
| Parameter | Test Method | Unit | G1 |
|---|---|---|---|
| Assay (GC) | GC-FID | % | ≥99.0 |
| Water Content (KF) | Karl Fischer | ppm | ≤1000 |
| Total Metals | ICP-OES | ppb ea. | ≤100 |
| Fe (Iron) | ICP-OES | ppb | ≤50 |
| Color (APHA) | ASTM D1209 | Hazen | ≤20 |
| Residue on Evap. | Gravimetric | ppm | ≤15 |
★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.
Grade Comparison
G1 → G5 Purity Scale
Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.
All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot. Request CoA template →
Application Areas
Where NMP Electronic G1 Grade Is Used
Semiconductor Process
- Thick positive photoresist stripping (≥180nm nodes)
- Polyimide (PI) precursor general coating
- LCD alignment layer (PI) coating
- General PCB polyimide laminate processing
Laboratory & Analytical
- Polymer research solvent
- PVDF dissolution (non-critical)
Industrial & Other
- Wire enamel insulation processing
- hollow fiber membrane manufacturing
- textile dyeing auxiliary
Battery & Energy Storage
Packaging & Supply
Available Container Formats
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