PGMEA for EUV & ArF Immersion Lithography
PGMEA is the dominant primary solvent in all advanced photoresist formulations from KrF through EUV, maintained by its unique combination of polymer solvency, controlled evaporation, and TMAH developer compatibility.
Why purity matters: EUV resist solvents are in direct contact with scanner optics via outgassing. Any metallic impurity deposits on EUV reflective optics during exposure. Total metals below 0.1 ppb (G5) is mandatory for EUV resist formulation.
Specification Requirements
Critical Parameters for EUV & ArF Immersion Lithography
Each parameter directly impacts process outcome — understand why each limit exists.
| Parameter | Requirement | Why This Limit Exists |
|---|---|---|
| Assay (GC) | ≥99.0% (G1) to ≥99.999% (G5) | Minimizes organic by-product background in resist film |
| Total Metals (ICP-MS) | ≤50 ppb (G1) to <0.1 ppb (G5) | EUV optic contamination risk from outgassed metal species |
| Acetic Acid (GC) | ≤50 ppm (G1) to ≤5 ppm (G5) | Acidity affects PAG stability in chemically amplified resists |
| Water (KF) | ≤500 ppm (G1) to ≤10 ppm (G5) | Excess water affects resist film thickness uniformity during spin |
| Peroxide (Iodometric) | ≤5 ppm (G1) to ≤0.5 ppm (G5) | Peroxides degrade polymer backbone and reduce resist shelf life |
Grade Selection
Which Grade Do You Need?
Match your process node and contamination budget to the right grade — every grade available with full CoA.
All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot. Request CoA template →
Technical FAQ
Expert Answers
Is PGMEA or PGME better as EBR solvent?
Both are used for EBR, often as mixtures. PGME (BP 120°C) evaporates faster and is preferred for EBR where rapid solvent removal is needed. PGMEA (BP 146°C) is preferred as the primary resist solvent for uniform film formation. Many fabs use PGME/PGMEA (10–30% PGME) mixtures for EBR.
What is SEMI C12?
SEMI C12 applies specifically to photoresist process solvents including PGMEA, PGME, n-propyl acetate, and n-butyl acetate. Beyond C1 metal and particle limits, C12 adds: acidity as acetic acid, peroxide content, color (APHA), and photoresist compatibility testing. PureTech PGMEA G4/G5 is fully SEMI C12 certified.
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EUV & ArF Immersion Lithography
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