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Sulfuric Acid (Electronic Grade)

H₂SO₄ · CAS 7664-93-9

Ultra-high purity sulfuric acid for piranha solution (SPM: H₂SO₄/H₂O₂), pre-diffusion organic clean, and photoresist strip. The most consumed wet chemical by volume in semiconductor fabs, used at every node from mature 180nm to sub-3nm.

Piranha solution (SPM) photoresist & organic stripPre-diffusion/implant wafer cleanOxide regrowth control pre-cleanGate oxide preparation cleanPost-implant photoresist strip (hot SPM)Al/Ti metal etch (dilute H₂SO₄)

Molecular Weight

98.07 g/mol

Boiling Point

337 °C

Density

1.840 g/mL

Molecular Formula

H₂SO₄
SEMI C12
CAS Number7664-93-9
Boiling Point337 °C
Density1.840 g/mL
MW98.07 g/mol

Available Grades

G2G3G4G5

Analytical Specification

Analytical Specification Table

All values represent maximum allowable limits unless noted ≥. A lot-specific Certificate of Analysis (CoA) with ICP-MS, LPC, and GC data is issued for every shipment. Full data packages available on request.

ParameterTest MethodUnitG4G5 ★
AssayTitration%96.0–98.096.0–98.0
Total MetalsICP-MSppb ea.≤0.5<0.1
Cl⁻ (Chloride)ICppb≤50≤10
Fe (Iron)ICP-MSppb≤0.2<0.05
NH₄⁺ICppb≤100≤20
Residue on Evap.Gravimetricppm≤5≤2

★ G5 = SEMI C1 Tier D (6N grade). All metal values by ICP-MS. Particle counts by in-line LPC during ISO Class 3 fill. CoA available on request.

Grade Comparison

G1 → G5 Purity Scale

Select the grade that matches your process node and contamination budget. Every grade is available from PureTech with full lot CoA and ICP-MS data.

Electronic Grade Purity Comparison — SEMI C1 StandardG1 → G5
GradePurity (GC)Metals (ICP)ParticlesWater (KF)Process Node
G1
≥99.0%
≤50 ppb≤500/mL≤500 ppmPCB / Display / Solar
G2
≥99.9%
≤10 ppb≤100/mL≤50 ppm≥180nm Mature Node
G3
≥99.99%
≤2 ppb≤20/mL≤20 ppm45–180nm
G4
≥99.999%
≤0.5 ppb≤10/mL≤10 ppm7–45nm
G5
≥99.9999%
<0.1 ppb≤5/mL≤5 ppm<7nm / EUV / Marangoni

All grades tested by ICP-MS (28 elements), in-line LPC (ISO Class 3 fill), and Karl Fischer titration. G5 = SEMI C1 Tier D. Full CoA per lot.  Request CoA template →

Application Areas

Where Sulfuric Acid Is Used

Semiconductor Process

  • Piranha solution (SPM) photoresist & organic strip
  • Pre-diffusion/implant wafer clean
  • Oxide regrowth control pre-clean
  • Gate oxide preparation clean
  • Post-implant photoresist strip (hot SPM)
  • Al/Ti metal etch (dilute H₂SO₄)

Laboratory & Analytical

  • Ion chromatography eluent
  • digestion of geological samples
  • titration standard

Industrial & Other

  • PCB etching & cleaning
  • metal surface treatment
  • fertilizer production

Battery & Energy Storage

Lead-acid battery electrolyte (industrial grade)

Packaging & Supply

Available Container Formats

1 L
5 L
20 L
200 L
IBC

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Technical Quote

Our application engineers respond with full CoA data, ICP-MS reports, and supply chain details within one business day.